Products Features:
◇ 6.00 W/mk high thermal conductivity
◇Premium Thermal Pad, Low Thermal Resistance
◇Ultra conformability for irregular gapping applications
Typical Applications Include:
--Between heat-generation Conponment and and heatsink.
--High-end Set Top Box, Graphices Cards, Telecom device.
--Wireless communication hardware
--Cooling Module, Thermal module.
--Server S-RAMs, BGA packages
Typical Properties of This Materials:
| Typical Properties of TCP600-PTY | |||||||
| Properties | Units | TCSF200 Series | Test Method | ||||
| Material | --- | Silicone | --- | ||||
| Color | --- | Lt. Grey | Visual | ||||
| Standard Form | --- | Mud | Visual | ||||
| Thickness | mm | 1.0~4.0 | --- | ||||
| Hardness | Shore C | 15 | ASTM D2240 | ||||
| Density | g/cc | 3.4 | ASTM D792 | ||||
| Volatilization Rate @200°C/24H | % | 0.15% | --- | ||||
| Young's Modulus | PSI | 213.194 | --- | ||||
| Continuous Use Temp | ℃ | -40 to 200 | EN344 | ||||
| ELECTRICAL | |||||||
| Breakdown Voltage | KV | 5 | ASTM D149 | ||||
| Dielectric Constant | 1MHz | 5 | ASTM D150 | ||||
| Volume Impedance | ohm-cm | 1.0 x1013 | ASTM D257 | ||||
| Flame Rating | --- | V 0 | ASTM D150 | ||||
| THERMAL | |||||||
| Thermal Resistance 1.5mm@3psi pressure |
℃-in²/W | 0.34 | ASTM D5470 | ||||
| Thermal Conductivity | W/m.k | 6.0 | ASTM D5470 | ||||
Configurations Available:
Sheet size:200 x 400mm, 350x350mm , die-cut parts available
Below info will be helpful for your right application
How to transfer or dissipate the heat from the heat-generating components to heat sinks?
How To Select the Right Thermal Interface Materials for your new application?
Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.