Products Features:
◇5.0 W/mk High Thermal Conductivity
◇Low Thermal Resistance at Low Pressure
◇Naturally tacky for easy applicaiton
Typical Applications Include:
--Between heat-generation Conponment and and heatsink
--Highly Stable at extreme Temperature
--Wireless Hub,Military equipment, power supply
--Cooling Module, Thermal module
--Server S-RAMs,BGA packages
Typical Properties of This Materials:
Typical Properties of TCP500 Silicone Thermal Pad | |||||||
Properties | Units | TCP500 | Test Method | ||||
Material | --- | Silicone& Ceramic | --- | ||||
Color | --- | Pink~Violet | Visual | ||||
Thickness Range | mm | 0.25~15 | --- | ||||
Natural tacky (1- or 2-sided) | g/cm3 | 2 | --- | ||||
Hardness | Shore C | 30 | ASTM-D2240 | ||||
Density | g/cc | 3.3(+/-0.1) | ASTM D792 | ||||
Continuous Use Temp | ℃ | -40 to 200 | EN344 | ||||
ELECTRICAL | |||||||
Breakdown Voltage(1mmT) | Kv/ac | ≥6 | ASTM D149 | ||||
Volume Impedance | (ohm-cm) | ≥7.1x1010 | ASTM D257 | ||||
Dielectric Constant | 1MHz | 6.6 | ASTM D150 | ||||
Flame Rating | V 0 | UL 94 | |||||
THERMAL | |||||||
Thermal Conductivity | W/m.k | 2.0 | ASTM D5470 |
0.25mm~15mm Thickness Thermal Gap Filler Pad/Heat Transfer Pad
Sheet size:200 x 400mm, 350x350mm , individual parts available
Part No. Code:
Suffix: Different Options For thermal Pad as below
"A1" suffix: One side additional adhesive such as 3M 467, 3M9448
"A2" suffix: Two sides additional adhesive such as 3M 467, 3M9448
"NA" suffix: Natural tacky
"D" suffix: one side tacky and non-tacky on the other side
"M" suffix: Fiberglass reinforcement in the middle layer
"F" suffix: Fiberglass reinforcement on top or bottom layer
Check List of Reliability Test Report for TC500 is available after your request
Below info will be helpful for your right application
How to transfer or dissipate the heat from the heat-generating components to heat sinks?
How To Select the Right Thermal Interface Materials for your new application?
Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.